Intel cooperates to develop the eighth-generation Core AMD
Intel cooperates to develop the eighth-generation Core AMD. “A country does not have permanent friends, only permanent interests.” This is a sentence from the 19th century British Prime Minister Palmerston, which became the foundation of British diplomacy. This is true from country to country, and from company to company. The latest Intel announcement recently proves this. Even the worst competitors can form partners in the face of the general trend of interests.
After a lot of rumors and subsequent denials, Christopher Walker, vice president and general manager of the customer computing group and mobile computing platform at Intel (Integrated Electronics Corporation), finally announced that AMD and Intel’s cooperation in their own CPU processors, Integrated AMD Radeon GPU graphics core, to bring a truly unique level of experience to thin and light notebooks.
Intel brought out the eighth-generation Core high-performance mobile version of the Coffee Lake-H CPU, and AMD offered a specially customized Vega architecture GPU, which is the latest masterpiece of both parties. Both are independent, integrated and packaged on the same substrate, interconnected with each other through a PCI-E 3.0 high-speed bus. Just like the RX Vega series of discrete graphics cards, the Vega GPU part will also have its own HBM2 high-bandwidth video memory with a bit width of 1024-bit, but it is not AMD ’s own interconnect layer with the GPU. Intel has redesigned embedded multi-die Interconnect Bridging (EMIB).
The core of this new design is EMIB, which is a small intelligent bridge, which can effectively connect the CPU, GPU, and dedicated video memory so that heterogeneous silicon can quickly transfer information under extremely close conditions. It can effectively eliminate the impact of height, manufacturing and design complexity to achieve smaller, faster, more powerful and more efficient products. It is also the first consumer product to utilize EMIB.
EMIB has always been a traditional server-level FPGA technology, and its advantages are self-evident, so some people are wondering how it can reach the average consumer. The new Intel® design and packaging innovation technology reduces the size of the silicon chip by more than 50%, combining high-performance CPU with AMD’s customized discrete graphics to achieve real-time power-sharing between the CPU and GPU to achieve optimal performance; Under the effective control of energy and energy consumption, the equipment can be made thinner and lighter.
Compared with Intel ’s integrated graphics solution, although Intel ’s integrated graphics solution is good, it is obviously not enough to meet the escalating modern workload and the need for thinness. And AMD’s new Vega architecture has been successfully implemented in the new Ryzen mobile CPU, so this unique combination may be a win-win situation for AMD, Intel, and consumers?
The outstanding performance of high-performance processors and graphics subsystems is crucial, and how to balance them to make the overall complex system thinner. Intel has added unique software drivers and interfaces to this semi-custom, discrete GPU, coordinating information between all three elements of the platform. Not only does it help manage temperature, power transfer, and performance status in real-time, it also enables system designers to adjust the power allocation ratio between processors and graphics based on workload and usage (such as performance games). The power-sharing architecture is Intel’s new custom connection between processors, discrete graphics chips, and dedicated graphics memory.
For OEMs, it provides room for adding new features, creating new circuit board layouts, exploring new cooling solutions or extending battery life. This new product does reduce the usual silicon size to less than half of the standard discrete components on the motherboard, which will give them more freedom, creativity and provide innovative thin and light designs with improved heat dissipation. In addition, this solution is the first notebook computer to use the second generation of high-bandwidth memory (HBM2), which consumes less power and consumes more space than traditional independent graphics designs that use dedicated graphics memory (such as GDDR5 memory) Less space. Ability to turn on thinner, lighter devices for laptops, 2-in-1 and mini-desktops while providing consumers with incredible performance and graphics.
At present, most enthusiasts’ laptops are equipped with Intel Core H-series processors and higher-power discrete graphics, with an average height of 26 mm. Once the new-generation H series is mass-produced, it will reduce the trend of thin and light notebook computers to 16 mm or less, and some can even be as thin as about 11 mm. The result is a thinner and lighter PC for gamers and content creators, enabling them to enjoy independent high-performance graphics experiences in gaming experiences and content creation applications.
All in all, cooperation between the two parties is a welcome development in many ways. Although this unusual cooperation has attracted everyone’s attention, we still look forward to it. Since last year, the cooperation between Intel and AMD has been rumored on the Internet. There was only one source to support it. AMD and Intel were both tight-lipped. When the news came out, it was doubtful or even surprising. Officials have finally confirmed this.
It is worth mentioning that this news is only one week after the GTX 1070 Ti was launched last week. Are AMD and Intel targeting NVIDIA? This time Intel compared the enemy’s (the hardest and most tired AMD, it is not only compared with Intel on the CPU but also with NVIDIA on the GPU; no one compares NVIDIA CPU with AMD CPU, Intel Comparing GPUs to AMD’s GPUs, it’s
strange that other people’s technology is not enough. It may be as simple as drawing a new generation of CPU to yourself. You must know that ARM and Intel cooperated to win IBM orders! IT companies in Lahore are also working on new technology to make sure that to spread awareness about these following technologies.